Joseph Shepard, Jr.: Process Development Engineer at Applied Materials, specialization in chemical vapor deposition, atomic layer deposition, and statistical process control.
Rajiv Joshi: Senior technical lead at IBM. Fellow of IEEE, and recipient of the IEEE Daniel E Noble award, and Industrial Pioneer Award of the IEEE Circuits and Systems Society.
Ted Letavic: CTO and VP, Computing and Wireless Infrastructure at GlobalFoundries.
Gabriel Loh: Senior fellow at Advanced Micro Devices, and 2018 recipient of the Wilkes award for his work in die-stacked architectures. Fellow of ACM and IEEE.
Lane Martin: Professor of Materials Science & Engineering and Bioengineering, Associate Department Chair, University of California, Berkeley.
Kristin Persson: Professor of Materials Science and Engineering, Faculty Staff Scientist at Lawrence Berkeley National Laboratory, Director of the Materials Project
Bruce Rayner: Principal Scientist – Atomic Layer Deposition (ALD) at the Kurt J. Lesker Company. His research interests are in ALD tool and process development.
Ian Young: Intel Senior Fellow, Director of Exploratory Integrated Circuits, Components Research. Founding editor-in-chief of IEEE J. Exploratory Solid-State Computational Devices
Glen Fox: President, Fox Materials Consulting. The principle consultant for anyone working on integration of ferroelectrics with semiconductors.
Grace Xing: William L. Quackenbush Professor of Engineering, Cornell. Experience in MBE and has huge amount of administrative experience.
Yoonsang Park: Thin Film TU, Samsung Advanced Institute of Technology (SAIT)